Thermoplastic resin composition, production method of thermoplastic resin composition, molding material, and light-emitting body

ABSTRACT

Disclosed is a production method of a thermoplastic resin composition comprising: blending a thermoplastic resin (A) and a metal complex (B) and a ligand (C2), wherein the metal complex (B) has a ligand (C1) coordinated therein, and wherein the ligand (C2) has a higher boiling point than the ligand (C1) under atmospheric pressure, and then heating and mixing the resulting blend at a temperature of not less than a boiling point of the ligand (C1) and not more than a boiling point of the ligand (C2), to produce a thermoplastic resin composition that can provide a light-emitting body at low cost in which a light-emitting material is dispersed in the resin in a good dispersion state, excellent in transparency and excellent in light-emitting properties of visible light; a molding material obtained by molding the thermoplastic resin composition; and a light-emitting body obtained by molding the thermoplastic resin composition.

TECHNICAL FIELD

The present invention relates to a thermoplastic resin composition, aproduction method of a thermoplastic resin composition, a moldingmaterial, and a light-emitting body.

BACKGROUND ART

Metal complexes are useful as light-emitting materials, and used asmaterials for organic electroluminescent devices and wavelengthconverting materials for LEDs. However, many of the metal complexes usedas light-emitting materials have low solubility in solvents or resins.For this reason, in the case where a metal complex is used as alight-emitting material, the metal complex is used as a thin film of themetal complex formed by a vacuum evaporation method, for example.

In such circumstances, tris(8-hydroxyquinolinato)aluminum (Alq3), whichis one of light-emitting materials for organic electroluminescentdevices, receives attention for its high quantum yield and highluminance. Alq3 is expected to be applied as a light-emitting bodydispersed in a resin or a wavelength converting material for LEDs. Alq3,however, has problems such as low solubility in solvents and lowmolecule dispersibility into resins.

In order to solve the problems above, Non Patent Literature 1 proposes amethod wherein a ligand having two quinolinol skeletons and an aluminumtrisacetylacetonate metal complex are subjected to a ligand exchangereaction in an organic solvent to obtain a polymeric metal complex whichcan be uniformly dispersed in a solvent such as methylene chloride.

CITATION LIST Non Patent Literature

-   Non Patent Literature 1: J. AM. CHEM. SOC. 2009, 131, 1787-1795

SUMMARY OF INVENTION Technical Problem

However, the method proposed in Non Patent Literature 1 has a problemsuch as high production cost because, to obtain a molded article or alight-emitting body in which the light-emitting material is dispersed ina good dispersion state in a resin, the resin and the light-emittingmaterial need to be once dispersed in a solvent uniformly, and thenmolding or production of the light-emitting body needs to be performed.Moreover, in the case where the light-emitting material is obtained as apowder, and then dispersed in the resin, dispersibility in the resin ispoor, and the quantum yield is low.

An object of the present invention is to provide a thermoplastic resincomposition that can provide a light-emitting body at low cost in whicha light-emitting material is dispersed in the resin in a good dispersionstate, excellent in transparency, and excellent in light-emittingproperties of visible light, a production method of a thermoplasticresin composition, a molding material obtained by molding thethermoplastic resin composition, and a light-emitting body obtained bymolding the thermoplastic resin composition.

Solution to Problem

The gist of the present invention is, as a first invention, a productionmethod of a thermoplastic resin composition (hereinafter, referred to asthe “production method of the present thermoplastic resin composition”)comprising: blending a thermoplastic resin (A) and a metal complex (B)and a ligand (C2), wherein the metal complex (B) has a ligand (C1)coordinated therein, and wherein the ligand (C2) has a higher boilingpoint than the ligand (C1) under atmospheric pressure, and then heatingand mixing the resulting blend at a temperature of not less than theboiling point of the ligand (C1) and not more than the boiling point ofthe ligand (C2). Herein, the “boiling point” designates a boiling pointunder atmospheric pressure unless otherwise specified.

The gist of the present invention is, as a second invention, athermoplastic resin composition obtained by the production method of thepresent thermoplastic resin composition (hereinafter, referred to as the“present thermoplastic resin composition”).

Further, the gist of the present invention is, as a third invention, amolding material obtained by molding the present thermoplastic resincomposition (hereinafter, referred to as the “present moldingmaterial”).

Moreover, the gist of the present invention is, as a fourth invention, alight-emitting body obtained by molding the present thermoplastic resincomposition or the present molding material (hereinafter, referred to asthe “present light-emitting body”).

Advantageous Effects of Invention

According to the present invention, a light-emitting body excellent inlight-emitting properties of visible light can be obtained at low costby dispersing a metal complex, which has a low dispersibility in aresin, in the resin in a good dispersion state, and the light rangingfrom ultraviolet light to visible light having a short wavelength can beconverted into longer visible light wavelength. Consequently, thepresent invention is suitable for utilization in optical material fieldsand electronic material fields such as solar cells, organic ELs, andliquid crystals.

DESCRIPTION OF EMBODIMENTS

Examples of the thermoplastic resin (A) used in the present inventioninclude acrylic resins, styrene resins, acrylonitrile-styrenecopolymers, olefin resins, polycarbonate resins, polyvinyl chlorideresins, polyvinylidene chloride resins, polyamide resins, polyesterresins, polyacetal resins, polyphenylene ether resins, polyethyleneterephthalate resins, polybutylene terephthalate resins, polyarylateresins, polyphenylene sulfide resins, polyethersulfone resins, polyetherimide resins, polyether ether ketone resins, polyether ketone resins,and fluorinated resins. These may be used alone or in combination of twoor more.

The thermoplastic resin (A) is preferably a thermoplastic resin that isin a molten state at 60 to 300° C. Examples of the thermoplastic resinthat is in a molten state at 60 to 300° C. include acrylic resins,styrene resins, acrylonitrile-styrene copolymers, olefin resins,polycarbonate resins, polyvinyl chloride resins, and polyester resins.Among these, acrylic resins, styrene resins, olefin resins, andpolycarbonate resins are preferable, and acrylic resins are morepreferable from the viewpoint of the light-emitting properties of thelight-emitting body to be obtained.

Examples of the acrylic resins include polymethyl methacrylate (PMMA);MMA-based copolymers obtained by copolymerizing methyl methacrylate(MMA) with another monomer, such as styrene, α-methylstyrene,acrylonitrile, acrylate, and methacrylate other than MMA; polymersincluding a methacrylate unit other than an MMA unit or an acrylate unitas a main component; and acrylic-based graft copolymers obtained bygraft copolymerizing a monomer such as (meth)acrylate with a polymercontaining a rubber, such as acrylic rubber, silicone rubber, andbutadiene rubber, as a main component. These may be used alone or incombination of two or more. In the present invention, “(meth)acrylate”designates “acrylate” or “methacrylate.”

Examples of the styrene resins include polystyrene (PS), high impactpolystyrene (HIPS), MMA-styrene copolymers (MS), MMA-butadiene-styrenecopolymers (MBS), styrene-maleic anhydride copolymers (SMA),styrene-methacrylic acid copolymers (SMAA), styrene-α-methylstyrenecopolymers, styrene-maleimide copolymers, acrylonitrile-styrenecopolymers, α-methylstyrene-acrylonitrile copolymers, and alloys of theresins above and polyphenylene ether resins. These may be used alone orin combination of two or more.

Examples of the acrylonitrile-styrene copolymers includeacrylonitrile-styrene copolymers (SAN), acrylonitrile-styrene-butadienecopolymers (ABS), acrylonitrile-styrene-acrylic rubber copolymers (AAS),acrylonitrile-styrene-chlorinated polyethylene copolymers (ACS),acrylonitrile-styrene-ethylene-propylene rubber copolymers (AES), andacrylonitrile-styrene-ethylene-vinyl acetate copolymers. Examplesthereof also include α-methylstyrene-based acrylonitrile copolymers inwhich a styrene portion in these copolymers is replaced byα-methylstyrene. These may be used alone or in combination of two ormore.

Examples of the olefin resin include polyethylene resins such as verylow density polyethylene, low density polyethylene, linear low densitypolyethylene, medium low density polyethylene, and high densitypolyethylene; ethylene-vinyl acetate copolymers in which a content of avinyl acetate unit is 0.1 to 25% by mass; ethylene-acrylic acidcopolymers in which a content of an acrylic acid unit is 0.1 to 25% bymass; polypropylene; ethylene-propylene block copolymers in which acontent of an ethylene unit is 2 to 40% by mass; ethylene-propylenerandom copolymers in which a content of an ethylene unit is 0.5 to 10%by mass; polybutene; ethylene-propylene rubbers;ethylene-propylene-diene rubbers; and cycloolefin resins (COP). Amongthese, COP, low density polyethylene, high density polyethylene, andpolypropylene are preferable from the viewpoint of excellent mechanicalproperties of the light-emitting body to be obtained. These may be usedalone or in combination of two or more.

Examples of the polycarbonate resins include those obtained by reactingdivalent phenol with a carbonylating agent by a method such as interfacepolycondensation or melt transesterification; those obtained bypolymerizing a carbonate prepolymer by a method such as solid phasetransesterification; and those obtained by polymerizing a cycliccarbonate compound by ring-opening polymerization. These may be usedalone or in combination of two or more. Examples of divalent phenolinclude hydroquinone, 4,4′-dihydroxydiphenyl,bis(4-hydroxyphenyl)methane, bis{(4-hydroxy-3,5-dimethyl)phenyl}methane,1,1-bis(4-hydroxyphenyl)ethane, 1,1-bis(4-hydroxyphenyl)-1-phenylethane,and 2,2-bis(4-hydroxyphenyl)propane (known as bisphenol A). Examples ofthe carbonylating agent include carbonyl halides such as phosgene,carbonate esters such as diphenyl carbonate, and haloformates such asdihaloformate of divalent phenol.

Examples of the polyvinyl chloride resins include polyvinyl chloride;vinyl chloride copolymers obtained by copolymerizing vinyl chloride withanother monomer such as ethylene, propylene, acrylonitrile, vinylidenechloride, and vinyl acetate; and modified polyvinyl chloride resins inwhich MBS, ABS, nitrile rubber, chlorinated polyethylene, an ethylenevinyl alcohol-vinyl chloride graft copolymer, a variety of plasticizersor the like are added to the polyvinyl chloride resins above. These maybe used alone or in combination of two or more.

In the present invention, the ligand (C1) is coordinated in the metalcomplex (B) described later. The ligand (C1) is preferably a ligandhaving a boiling point of 60 to 200° C. from the viewpoint of easyremoval after release from the metal complex (B) by ligand exchange. Theligand (C1) including no aromatic ring is more preferable from theviewpoint of excellent dispersibility in the thermoplastic resin (A).

Examples of the ligand (C1) having a boiling point of 60 to 200° C.include β-diketone compounds such as acetylacetone (boiling point of140° C.), trifluoroacetylacetone (boiling point of 105° C.), andhexafluoroacetylacetone (boiling point of 70° C.); alcohols such asmethanol (boiling point of 65° C.), ethanol (boiling point of 78° C.),propanol (boiling point of 97° C.), isopropanol (boiling point of 82°C.), and butanol (boiling point of 117° C.); carboxylic acids such asformic acid (boiling point of 100° C.), acetic acid (boiling point of117° C.), and propionic acid (boiling point of 141° C.); and acetoaceticacid esters such as methyl acetoacetate (boiling point of 170° C.), andethyl acetoacetate (boiling point of 180° C.). These may be used aloneor in combination of two or more. Among these, acetylacetone, ethylacetoacetate, and isopropanol are preferable from the viewpoint of thedispersibility of the metal complex (B) in the resin and easy removalafter release.

In the metal complex (B) used in the present invention, the ligand (C1)described above is coordinated with a metal. Examples of the metal inthe metal complex (B) include elements in Group 1 excluding hydrogen,Group 2, Group 3 including lanthanoids and actinoids, Group 4, Group 5,Group 6, Group 7, Group 8, Group 9, Group 10, Group 11, Group 12, Group13 excluding boron, Group 14 excluding carbon, Group 15 excludingnitrogen, phosphorus, and arsenic, and Group 16 excluding oxygen,sulfur, selenium, and tellurium in the periodic table.

Specific examples of the metals in the metal complex (B) include Li, Na,K, Rb, Cs, Be, Mg, Ca, Sr, Ba, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd,Tb, Dy, Ho, Er, Tm, Yb, Lu, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Tc,Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Hg, Al, Ga,In, TI, Si, Ge, Sn, Pb, Sb, and Bi. These metals can be properlyselected according to the light emission color of the presentlight-emitting body described later. These metals may be used alone orin combination of two or more. Among these metals, Be, Mg, Zn, Al, Cu,Pt, Eu, Ga, In, Co, and Ir are preferable, and Al and Zn are morepreferable from the viewpoint of the light-emitting properties of thepresent light-emitting body.

Examples of the metal complex (B) include aluminum acetylacetonate(melting point: 195° C.), aluminum isopropoxide (melting point: 131°C.), aluminum ethoxide (melting point: 140° C.), ethyl acetoacetatealuminum diisopropoxide (liquid at room temperature), aluminumtris(ethyl acetoacetate) (melting point: 75° C.), zinc acetylacetonate(melting point: 138° C.), zinc acetate (melting point: 237° C.),magnesium diethoxide (melting point: 270° C.), cobalt(II)acetylacetonate (melting point: 170° C.), cobalt(III) acetylacetonate(melting point: 210° C.), copper(II) acetylacetonate (melting point:288° C.), tris(acetylacetonate)indium(III) (melting point: 189° C.),iridium acetylacetonate (melting point: 271° C.), galliumacetylacetonate (melting point: 198° C.), europium acetylacetonate(melting point: 140° C.), and platinum acetylacetonate (melting point:252° C.). Considering dispersibility in the resin, the central metalpreferably has a valency of 2 or more. Further, at a valency of thecentral metal of 3 or more, the metal complex has a stereostructure,leading to weak aggregation of metal complexes. Additionally, thecentral metal is easily surrounded by the ligand, leading to less watercoordination. As a result, dispersibility in the resin is enhanced. Forthis reason, the central metal in the metal complex (B) more preferablyhas a valency of 3 or more. The metal complexes (B) may be used alone orin combination of two or more.

The ligand (C2) used in the present invention is a ligand having aboiling point higher than that of the ligand (C1). Particularly, theligand having a boiling point 30° C. or more higher than the boilingpoint of the ligand (C1) is preferable. Moreover, the ligand (C2) ispreferably the ligand having one or two functional groups that can forma chemical bond with the metal, and one or two unshared electron pairsthat can be physically interactive with the metal, in the ligandmolecule. Here, the chemical bond with the metal means a bond chemicallyformed between the metal and an element in the molecule. Examples offunctional groups that can form a chemical bond with the metal include ahydroxyl group, a carboxylic acid group, an amino group, anacetylacetonate (keto-enol tautomeric) group, and a thiol group.Examples of the structure having the unshared electron pair(s) that canbe physically interactive with the metal include those having a nitrogenatom, ether oxygen in tetrahydrofuran or the like, a nitrile group, acarbonyl group, nitrogen in imidazole not bonded to hydrogen, a sulfonylgroup, a nitro group, or a nitroso group.

The temperature in the heating and mixing is set at a temperature higherthan the boiling point of the ligand (C1) and not more than the boilingpoint of the ligand (C2). Thereby, the ligand (C1) in the metal complex(B) is subjected to ligand exchange for the ligand (C2). Additionally,the released ligand (C1) can be easily discharged to the outside of thesystem, and the ligand exchange reaction can be accelerated. For thisreason, the ligand (C2) preferably has the boiling point underatmospheric air 30° C. or more higher than the boiling point underatmospheric air of the ligand (C1). Moreover, the ligand (C2) ispreferably a ligand having one or two functional groups that can form achemical bond with the metal in the chemical structure of the ligand(C2), and one or two unshared electron pairs that can be physicallyinteractive with the metal because crosslinking of metal complexes withthe ligand (C2) can be suppressed in the ligand exchange, providing gooddispersibility in the resin.

Examples of the ligand (C2) include 2-quinolinol, 3-quinolinol,4-quinolinol, 5-quinolinol, 6-quinolinol, 7-quinolinol, 8-quinolinol(boiling point of 267° C.), 2-alkyl-8-quinolinol, 3-alkyl-8-quinolinol,4-alkyl-8-quinolinol, 5-alkyl-8-quinolinol, 6-alkyl-8-quinolinol, and7-alkyl-8-quinolinol (alkyl group is a linear or branched hydrocarbongroup having 1 to 4 carbon atoms (all have a boiling point of 200 to267° C.)), dibenzoyl methane (boiling point of 357° C.),4,4,4-trifluoro-1-(2-thienyl)-1,3-butanedione (boiling point of 104°C./9 mmHg, boiling point under atmospheric pressure of 240° C.),1-phenyl-1,3-butanedione (boiling point of 262° C.),2,2,6,6-tetramethyl-3,5-heptadione (boiling point of 80° C./12 mmHg,boiling point under atmospheric pressure of 200° C.), and2-(2-hydroxyphenyl)benzooxazole (boiling point of 338° C.). These may beused alone or in combination of two or more. For example, 8-quinolinolhas one chemical bond with metal formed by the reaction between an OHgroup and the metal, and one physical interaction of a nitrogen atom viathe unshared electron pair. The ligand (C2) is preferably a compoundother than polyalkylene glycol.

From the viewpoint of the light-emitting properties of thelight-emitting body, the ligand (C2) is a ligand having a boiling pointof preferably not less than 200° C., and is a ligand having a boilingpoint of particularly preferably not less than 200° C. and not more than500° C. such as 8-quinolinol, 2-alkyl-8-quinolinol, and2-(2-hydroxyphenyl)benzooxazole, and 8-quinolinol and2-alkyl-8-quinolinol are more preferable.

The present thermoplastic resin composition is a thermoplastic resincomposition obtained by blending a thermoplastic resin (A) and a metalcomplex (B) and a ligand (C2), wherein the metal complex (B) has aligand (C1) coordinated therein, and wherein the ligand (C2) has ahigher boiling point than the ligand (C1) under atmospheric pressure,and then heating and mixing the resulting blend at a temperature of notless than the boiling point of the ligand (C1) and not more than theboiling point of the ligand (C2).

The blending amount of the metal complex (B) in the presentthermoplastic resin composition is preferably 0.001 to 30 parts by mass,more preferably 0.005 to 10 parts by mass, and particularly preferably0.01 to 10 parts by mass based on 100 parts by mass of the thermoplasticresin (A). If a blending amount of the metal complex (B) is 0.001 partsby mass or more, the light-emitting body to be obtained is excellent inlight emission strength. If the blending amount of the metal complex (B)is 30 parts by mass or less, the ligand (C1) or a decomposition gasderived from the ligand (C1), generated by the ligand exchange of themetal complex (B) during the heating and mixing, is easily treated. Theblending amount of the metal in the present thermoplastic resincomposition is preferably 10 to 20000 ppm (parts by mass, hereinafter,also simply referred to as ppm), and more preferably 100 to 5000 ppmbased on 100 parts by mass of the thermoplastic resin (A) from theviewpoint of the transparency and light-emitting properties of thelight-emitting body to be obtained by molding the thermoplastic resincomposition.

The blending amount of the ligand (C2) in the present thermoplasticresin composition is preferably 0.0001 to 1,000 parts by mass, morepreferably 0.01 to 100 parts by mass, and particularly preferably 0.1 to30 parts by mass based on 100 parts by mass of the thermoplastic resin(A). If the blending amount of the ligand (C2) is 0.0001 parts by massor more, the light-emitting body to be obtained is excellent inlight-emitting properties. If the blending amount of the ligand (C2) is1,000 parts by mass or less, the light-emitting body to be obtained isexcellent in transparency and light-emitting properties.

The largest blending amount w_(C2) of the ligand (C2) in the presentthermoplastic resin composition (parts by mass based on 100 parts bymass of the thermoplastic resin) can be expressed by the followingequation (1) using molecular weight M_(C2) of the ligand (C2), themolecular weight M_(B) of the metal complex (B), the largestcoordination number n of the metal complex (B), and the blending amountw_(B) of the metal complex (B):w _(C2) =w _(B) /M _(B) ×n×M _(C2)  (1)

The blending amount of the ligand (C2) is preferably twice or less thanthe largest blending amount w_(c2) because the exchange of the ligand(C1) in the metal complex (B) can be accelerated sufficiently, and theunreacted ligand (C2) can be easily discharged to the outside of thesystem.

The temperature in heating and mixing the thermoplastic resin (A), themetal complex (B), and the ligand (C2) is a temperature of not less thanthe boiling point of the ligand (C1) and not more than the boiling pointof the ligand (C2). Even if the heating and mixing temperature is atemperature not more than the melting point of the metal complex (B),the metal complex (B) may be dispersed in the thermoplastic resin (A) atthe heating and mixing temperature. In the case where the metal complex(B) is difficult to disperse in the thermoplastic resin (A), heating andmixing is preferably performed at a temperature of the melting point ofthe metal complex (B) or more.

For example, when PMMA as the thermoplastic resin (A), aluminumacetylacetonate (melting point: 195° C.) as the metal complex (B) inwhich the ligand (C1) is acetylacetone (boiling point of 140° C.), and8-quinolinol as the ligand (C2) (boiling point of 126° C./10 mmHg(equivalent to 267° C.)) are used, the heating and mixing temperature isnot less than 140° C. which is the boiling point of acetylacetone as theligand (C1). PMMA as the thermoplastic resin (A) is preferably kneadedat a temperature of not less than 200° C. For this reason, the heatingand mixing temperature above is preferably not less than 200° C.

Further, 8-quinolinol as the ligand (C2) has the boiling point of 126°C./10 mmHg (boiling point under atmospheric pressure: 267° C.), and theheating and mixing temperature is set at 140 to 267° C. The heating andmixing temperature for the thermoplastic resin (A), the metal complex(B), and the ligand (C2) is preferably set at 140 to 267° C. because theligand (C2) will not vaporize and will be in the mixture during theheating and mixing, and can contribute the exchange reaction of theligand (C1) in the metal complex (B).

In the present invention, when necessary, after the thermoplastic resin(A), the metal complex (B), and the ligand (C2) are heated and mixed,the temperature can be further raised to a temperature of not less thanthe boiling point of the ligand (C2) to perform the heating and mixingagain. Thereby, the unreacted ligand (C2) can be discharged to theoutside of the system.

In the present invention, to accelerate the reaction by efficientlydischarging the ligand (C1) separated during heating and mixing of thethermoplastic resin (A), the metal complex (B), and the ligand (C2) tothe outside of the system, the heating and mixing of the thermoplasticresin (A), the metal complex (B), and the ligand (C2) can be performedunder reduced pressure.

The heating and mixing time for the thermoplastic resin (A), the metalcomplex (B), and the ligand (C2) can be properly set according to themolten state of the thermoplastic resin (A), and the reaction state ofthe ligand (C2) and the metal complex (B). The heating and mixing timeis preferably 0.5 to 60 minutes. A heating and mixing time of 0.5minutes or more accelerates exchange of the ligand in the metal complex(B), attaining good light emission strength of the presentlight-emitting body. A heating and mixing time of 60 minutes or less cansuppress decomposition of the thermoplastic resin (A) not to impair theproperties intrinsic to the thermoplastic resin (A).

Examples of mixing apparatuses for heating and mixing the thermoplasticresin (A), the metal complex (B), and the ligand (C2) include a singlescrew extruder, a multi-screw extruder having two or more screws, aBanbury mixer, a kneader, and a roll. Among these mixing apparatuses,the single screw extruder and the multi-screw extruder having two ormore screws are preferable from the viewpoint of good dispersibility ofthe reaction product of the metal complex (B) and the ligand (C2) in themolding material and the light-emitting body and from the viewpoint ofexcellent light emission strength of the light-emitting body to beobtained.

Examples of a method of heating and mixing the thermoplastic resin (A),the metal complex (B), and the ligand (C2) when an extruder is used asthe mixing apparatus, include a method in which the thermoplastic resin(A), the metal complex (B), and the ligand (C2) are fed into theextruder from a raw material feeding hopper upstream side thereof andmixed; and a method in which the thermoplastic resin (A) is fed from araw material feeding hopper, and heated and molten, and the metalcomplex (B) and the ligand (C2), or the metal complex (B) and ligand(C2) diluted with an organic solvent are injected from some midpoint ofthe extruder, and mixed.

The present molding material is obtained by molding the presentthermoplastic resin composition. Examples of forms of the presentmolding material include pellet-like products, foamed beads, film-likeor sheet-like products, and foamed film-like or sheet-like products.

To obtain the pellet-like product, a known mixing apparatus can be usedas the mixing apparatus, for example. Examples of a pelletizing methodinclude a method in which using a single screw extruder or a multi-screwextruder having two or more screws, a Banbury mixer, a kneader, a roll,or the like, a strand-like product discharged from the mixing apparatusis cut into strip shape to be pelletized.

Examples of a method for obtaining a film-like or sheet-like productinclude a (co)extrusion method, a press method, and a casting method.

The present light-emitting body is obtained by molding the presentthermoplastic resin composition or the present molding material.Examples of a molding method for obtaining the present light-emittingbody include injection molding, extrusion molding, blow molding,inflation molding, vacuum molding, compression molding, and foamingmolding.

For excellent light-emitting properties of the present light-emittingbody, practically sufficient light emission is obtained even in use ofexcitation light source having low energy such as black light.

Examples of the black light usable as the excitation light source forthe present light-emitting body include the black light having a peakwavelength in the vicinity of the wavelength of 350 nm. The visiblelight having a peak in the vicinity of the wavelength 400 nm can also beused as the excitation light source usable for the presentlight-emitting body.

EXAMPLES

Hereinafter, the present invention will be described using Examples. Inthe following, “parts” and “%” designate “parts by mass” and “% bymass,” respectively. The transmittance and quantum yield of thelight-emitting body obtained were measured according to the methodsshown below.

(1) Transmittance

The transmittance of a test piece of the light-emitting body obtainedwas measured at wavelengths of 400 nm, 600 nm, and 800 nm using aspectrophotometer (made by Hitachi, Ltd., trade name: U-3300). Thetransmittance was used as an index of the dispersibility of the metalcomplex (B) in the thermoplastic resin (A) in the light-emitting body.

(2) Light Emission Color, Internal Quantum Yield, and Peak Wavelength

The surface of a test piece of the light-emitting body obtained (10mm×20 mm) was set within an integrating sphere in an absolute quantumyield measurement apparatus (made by Otsuka Electronics Co., Ltd., tradename: PE-1100), and the light emission spectrum in use of the excitationlight at an excitation wavelength of 365 nm was measured. From theobtained data, the light emission color and the peak wavelength of thelight emission color were specified. The internal quantum yield wascalculated, which is a value obtained by dividing the number of photonsemitted from the light-emitting body by the number of photons absorbedin the light-emitting body in the irradiated excitation light. Theinternal quantum yield was used as an index of the light-emittingproperties.

Synthesis Example 1

30 mL of a toluene solution of 3.19 g of 8-quinolinol (22 mmol) wasdropped into 6.66 mL of a toluene solution of 15% triethylaluminum (7.3mmol of triethylaluminum) under stirring at room temperature over 1 hourto obtain a toluene dispersion liquid oftris(8-hydroxyquinolinato)aluminum (Alq3). The obtained toluenedispersion liquid of Alq3 was left overnight as it was under roomtemperature. Then, the precipitated solid was filtered. Next, theobtained filtrate was condensed under reduced pressure to obtain adeposited powder; the powder was washed with a small amount of toluene,and dried to obtain 2.8 g of a powder of Alq3 (yield of 88%).

Synthesis Example 2

A cooling tube and a stirrer were set in a 100 ml eggplant flask. 2.8 g(11 mmol) of zinc acetylacetonate (made by Tokyo Chemical Industry Co.,Ltd.), 50 mL of dimethylformamide, and 3.19 g (22 mmol) of 8-quinolinolwere placed in the flask to obtain a dimethylformamide dispersion liquidof bis(8-hydroxyquinolinato)zinc(II) (Znq2). The dispersion liquid wasdropped into 1000 ml of water little by little. The deposited solid wasfiltered, and recovered. The recovered solid was washed with a smallamount of methanol, and dried to obtain 2.5 g of a powder of Znq2 (yieldof 64%).

Example 1

100 parts of polymethyl methacrylate as the thermoplastic resin (A)(made by MITSUBISHI RAYON CO., LTD., trade name: VHK), 0.25 parts ofaluminum acetylacetonate as the metal complex (B) (made by TokyoChemical Industry Co., Ltd.) (the content of the metal in the resin was208 ppm), and 0.34 parts of 8-quinolinol as the ligand (C2) (made byKANTO CHEMICAL CO., INC.) were charged into a compact injection moldingmachine (made by Custom Scientific Instruments Inc., trade name: CS-183MMX), and mixed at a temperature of 250° C. for 5 minutes to obtain apellet.

The obtained pellet was dissolved in deuterochloroform such that theconcentration was 5%. The solution was measured using a ¹H-NMRmeasurement apparatus (made by JEOL, Ltd., trade name: JNM-EX270). Thepeaks of protons derived from the quinolinol skeleton bonded to aluminumwere observed at 7.2 to 9.0 ppm. The peak of protons derived from theacetylacetonate skeleton bonded to aluminum was observed at 5.5 ppm. Asabove, it was confirmed that aluminum acetylacetonate was subjected tothe ligand exchange for 8-quinolinol in the obtained pellet. In thepellet, a mixture of aluminum acetylacetonate,tris(8-hydroxyquinolinato)aluminum,bis(8-hydroxyquinolinato)acetylacetonate aluminum, andbis(acetylacetonate)-8-hydroxyquinolinato aluminum was found.

The obtained pellet was charged into the compact injection moldingmachine above again, and kneaded at a temperature of 250° C. for 1minute. Then, the kneaded product was molded using the compact injectionmolding machine to obtain a test piece of the light-emitting bodymeasuring 10 mm×20 mm×2 mm. The surface of the obtained test piece wasmirror polished using a polisher (made by Marumoto Kogyo K.K., type:5629) to obtain a test piece of the light-emitting body measuring 10mm×20 mm×1.5 mm. The results of evaluation are shown in Table 1.

Examples 2 to 15

A test piece of the light-emitting body was obtained in the same manneras in Example 1 except that the kinds of the thermoplastic resin (A),the metal complex (B), and the ligand (C2), the blending amountsthereof, the heating and mixing temperature, and the heating and mixingtime were changed as shown in Table 1. The results of evaluation areshown in Table 1.

Comparative Example 1

A test piece of the light-emitting body was obtained in the same manneras in Example 1 except that 0.35 parts of Alq3 as the metal complex (B)(the content of the metal in the resin was 208 ppm) was used, and noligand (C2) was used. The results of evaluation are shown in Table 2.

Comparative Examples 2 to 9

A test piece of the light-emitting body was obtained in the same manneras in Comparative Example 1 except that the kind of the metal complex(B), the blending amount thereof, the heating and mixing temperature,and the heating and mixing time were changed as shown in Table 2. Theresults of evaluation are shown in Table 2.

TABLE 1 Ex- Ex- Ex- Ex- Ex- Ex- Ex- Ex- ample ample ample ample ampleample ample ample 1 2 3 4 5 6 7 8 Thermoplastic Kind PMMA PMMA PMMA PMMAPMMA PMMA PMMA PMMA Resin (A) [Parts] 100  100  100  100 100 100 100 100Metal Kind B-1 B-1 B-1 B-1 B-1 B-1 B-1 B-2 Complex (B) [Parts]  0.25  2.0   4.0   0.25  0.5  0.5  0.5  0.007 Ligand Kind C2-1 C2-1 C2-1 C2-1C2-1 C2-1 C2-1 C2-1 (C2) [Parts]  0.34   3.4   6.8   0.34  0.23  0.46 0.68  0.0078 Metal Content [ppm] 208 1667 3333  208 417 417 417  17Heating and Mixing 250  250  250  220 220 220 220 250 Temperature [° C.]Heating and Mixing  5   5   5   3  3  3  3  5 Time [min] MoldingTemperature 250  250  250  220 220 220 220 250 [° C.] Transmittance 400nm  0   0   0   0  0  0  0  83 [%] 600 nm  90  39  31  89  91  91  90 90 800 nm  92  41  36  90  91  90  90  91 Light Emission Color GreenGreen Green Green Green Green Green Green Internal Quantum  39  36  32 39  43  40  38  4 Yield [%] Peak Wavelength [nm] 513  513  513  512 511512 513 500 Ex- Ex- Ex- Ex- Ex- Ex- Ex- ample ample ample ample ampleample ample 9 10 11 12 13 14 15 Thermoplastic Kind PMMA PMMA PMMA MS MSPS PS Resin (A) [Parts] 100 100  100 100 100  100 100 Metal Kind B-2 B-2B-2 B-1 B-3 B-2 B-3 Complex (B) [Parts]  0.056  0.28   0.56  0.5  0.5  0.5  0.5 Ligand Kind C2-1 C2-1 C2-1 C2-1 C2-2 C2-2 C2-1 (C2) [Parts] 0.062  0.31   0.62  0.68  0.88   0.63  0.68 Metal Content [ppm] 138 6901380 417 493 1233 493 Heating and Mixing 250 250  250 220 220  220 220Temperature [° C.] Heating and Mixing  5  5   5  3  3   3  3 Time [min]Molding Temperature 250 250  250 220 220  220 220 [° C.] Transmittance400 nm  14  0   0  0  0   0  0 [%] 600 nm  79  48  16  86  87  85  85800 nm  83  62  27  89  89  87  87 Light Emission Color Yellow YellowYellow Green Light Yellow Green blue Internal Quantum  16  16  16  26 28  23  31 Yield [%] Peak Wavelength [nm] 540 540  540 516 493  537 522

TABLE 2 Compar- Compar- Compar- Compar- Compar- Compar- Compar- Compar-Compar- ative ative ative ative ative ative ative ative ative ExampleExample Example Example Example Example Example Example Example 1 2 3 45 6 7 8 9 Thermoplastic Kind PMMA PMMA PMMA PMMA PMMA PMMA PMMA PMMAPMMA Resin (A) [Parts] 100  100  100 100 100 100 100 100  100 Metal KindAlq3 Alq3 Alq3 Alq3 Alq3 Znq2 Znq2 Znq2 Znq2 Complex (B) [Parts]  0.35 2.84   5.67 0.35  0.71  0.0094  0.0751  0.3757   0.7514 Ligand (C2)Kind — — — — — — — — — [Parts] — — — — — — — — — Metal Content [ppm] 2081667 3333 208 417  17 138 690 1380 Heating and Mixing 250  250  250 220220 250 250 250  250 temperature [° C.] Heating and Mixing  5   5   5  3 3  5  5  5   5 Time [min] Molding 250  250  250 220 220 250 250 250 250 Temperature [° C.] Transmittance 400 nm  0   0   0  0  0  82  10  0  0 [%] 600 nm  82   3   1  84  30  88  74  39  14 800 nm  84  10   4 85  45  90  80  60  23 Light Emission Color Green Green Green GreenGreen Green Yellow Yellow Yellow Internal Quantum Yield  31  31  31  31 31  3  17  19  16 [%] Peak Wavelength [nm] 513  518  519 515 519 500525 538  542

Abbreviations described in Tables 1 and 2 designate compounds below,respectively.

PMMA: polymethyl methacrylate (trade name: VHK, made by MITSUBISHI RAYONCO., LTD.)

MS: methyl methacrylate-styrene copolymer (trade name: BR-52, made byMITSUBISHI RAYON CO., LTD.)

PS: polystyrene (trade name: TOYO STYROL G200C, made by TOYO STYRENECo., Ltd.)

B-1: aluminum acetylacetonate (made by Tokyo Chemical Industry Co.,Ltd.) [ligand acetylacetone has a boiling point of 140° C.]

B-2: zinc acetylacetonate (made by Tokyo Chemical Industry Co., Ltd.)[ligand acetylacetone has a boiling point of 140° C.]

B-3: aluminum ethylacetoacetate diisopropoxide (trade name: ALCH, madeby Kawaken Fine Chemicals Co., Ltd.) [ligand ethyl acetoacetate has aboiling point of 180° C.]

C2-1: 8-quinolinol (made by KANTO CHEMICAL CO., INC., boiling point of267° C.)

C2-2: 2-methyl-8-quinolinol (made by Tokyo Chemical Industry Co., Ltd.,boiling point of 267° C.)

It becomes apparent that, at the same content of the metal, thelight-emitting bodies obtained in Examples 1 to 11 have highertransmittance and internal quantum yield of the light-emitting bodiesthan those of the light-emitting bodies obtained in Comparative Examples1 to 9, that is, the light-emitting bodies obtained by blending only themetal complex with the thermoplastic resin, and extruding and moldingthe blend, and that, conversion into a good light emission color isperformed even in use of visible light having a wavelength of 400 nm asa light source.

The invention claimed is:
 1. A production method of a thermoplasticresin composition, blending a thermoplastic resin (A) and a metalcomplex (B) and a ligand (C2), wherein the metal complex (B) has aligand (C1) coordinated therein, and wherein the ligand (C2) has ahigher boiling point than the ligand (C1) under atmospheric pressure,and then heating and mixing the resulting blend at a temperature of notless than the boiling point of the ligand (C1) and not more than theboiling point of the ligand (C2).
 2. The production method of athermoplastic resin composition according to claim 1, wherein the ligand(C2) has one or two functional groups that can form a chemical bond witha metal, and one or two unshared electron pairs that are physicallyinteractive with the metal, in the ligand molecule.
 3. The productionmethod of a thermoplastic resin composition according to claim 1,wherein the ligand (C2) is a compound other than polyalkylene glycol. 4.The production method of a thermoplastic resin composition according toclaim 1, wherein the ligand (C1) has a boiling point under atmosphericpressure of 60 to 200° C.
 5. The production method of a thermoplasticresin composition according to claim 1, wherein the boiling point underatmospheric pressure of ligand (C2) is higher than the boiling pointunder atmospheric pressure of the ligand (C1), and the difference is 30°C. or more.
 6. The production method of a thermoplastic resincomposition according to claim 1, wherein the ligand (C2) has a boilingpoint under atmospheric pressure of not less than 200° C.
 7. Theproduction method of a thermoplastic resin composition according toclaim 1, wherein a central metal of the metal complex (B) is at leastone selected from the group consisting of Be, Mg, Zn, Al, Cu, Pt, Eu,Ga, In, Co, and Ir.